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Wspc Series in Advanced Integration and Packaging
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Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research 이동[외서] Cooling of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research [ Hardcover ]Iyengar, Madhusudan / Geisler, Karl J. L. / Sammakia, Bahgat G. World Scientific Publishing Company157,000원 포인트적립3,140원Hardcover품절 판매시작 알림신청 -
Design and Modeling for 3D ICS and Interposers 이동[외서] Design and Modeling for 3D ICS and Interposers [ Hardcover ]Swaminathan, Madhavan / Han, Ki Jin World Scientific Publishing Company143,000원 포인트적립2,860원Hardcover품절 판매시작 알림신청
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