[직수입양서]
Microelectronics Packaging Handbook, 3-Part Set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging
[ Hardcover ]
Tummala, Rao R. / Rymaszewski, Eugene J. / Klopfenstein, Alan G.
Springer-Verlag New York Inc
10%
751,770원
포인트적립37,590원
11/3(금) 도착예정
Hardcover