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01 반도체
테스트의 이해 01. 반도체 후공정 ······················································ 5 02. 테스트의 종류······················································ 8 03. 웨이퍼 테스트 ···················································· 10 EPM ································································ 13 웨이퍼 번인······················································· 13 테스트 ····························································· 14 리페어······························································ 15 04. 패키지 테스트 ···················································· 16 TDBI································································ 17 테스트 ····························································· 18 외관 검사·························································· 18 02 반도체 패키지의 정의와 역할 01. 반도체 패키지의 정의········································· 25 02. 반도체 패키지의 역할 ········································ 26 03. 반도체 패키지의 개발 트렌드····························· 28 04. 반도체 패키지 개발 과정 ··································· 31 03 반도체 패키지의 종류 01. 반도체 패키지의 분류······················································ 39 02. 컨벤셔널 패키지·······························································41 플라스틱 패키지 - 리드프레임 타입 패키지··························41 플라스틱 패키지 - 서브스트레이트 타입 패키지 ·················· 43 세라믹 패키지 ································································ 46 03. 웨이퍼 레벨 패키지························································· 47 웨이퍼 레벨 패키지 ························································· 47 재배선··········································································· 56 플립 칩·········································································· 58 04. 적층 패키지····································································· 66 패키지 적층 ··································································· 67 칩 적층 - Chip Stack with Wire Bonding··························· 70 실리콘 관통 전극 - Chip Stack with TSV ··························· 73 05. 시스템 인 패키지····························································· 86 04 반도체 패키지 설계와 해석 01. 반도체 패키지 설계 ························································· 97 02. 구조 해석······································································· 101 휨 해석········································································ 104 솔더 접합부 신뢰성 ······················································· 106 강도 해석····································································· 108 03. 열 해석 ·········································································· 109 04. 전기 해석 ······································································113 05 반도체 패키지 공정 01. 컨벤셔널 패키지 공정·······································123 백 그라인딩 ····················································124 웨이퍼 절단·····················································127 다이 어태치 ····················································131 인터커넥션······················································137 몰딩·······························································143 마킹·······························································144 트리밍 - 리드프레임·········································146 솔더 도금 - 리드프레임·····································147 성형 - 리드프레임············································147 솔더 볼 마운팅 - 서브스트레이트 ·······················148 싱귤레이션 - 서브스트레이트 ····························152 02. 웨이퍼 레벨 패키지 공정··································153 포토 공정 ·······················································156 스퍼터링 공정 ················································· 161 전해도금 공정 ·················································163 습식 공정 - PR 스트립과 금속 에칭 ····················166 팬인 WLCSP 공정············································167 솔더 볼 마운팅 공정·········································168 플립 칩 범프 공정 ············································169 재배선 공정 ····················································171 팬아웃 WLCSP 공정·········································172 실리콘 관통 전극 패키지 공정···························· 174 03. 검사와 측정······················································187 검사·······························································187 측정·······························································192 06 반도체 패키지 재료 01. 컨벤셔널 패키지 재료···················································· 208 리드프레임 ·································································· 208 서브스트레이트···························································· 210 접착제········································································· 217 에폭시 몰딩 컴파운드···················································· 222 솔더 ··········································································· 225 테이프········································································· 228 와이어 ········································································ 229 포장 재료 ···································································· 230 02. 웨이퍼 레벨 패키지 재료··············································· 231 포토 레지스트 ······························································ 231 도금 용액····································································· 234 PR 스트립퍼································································· 235 에천트········································································· 237 스퍼터 타깃 ································································· 238 언더필········································································· 238 캐리어와 접착제, 마운팅 테이프······································ 240 07 반도체 패키지 신뢰성 01. 신뢰성 의미 ··································································· 247 02. JEDEC 기준··································································· 248 03. 수명 신뢰성 시험··························································· 253 EFR ············································································ 253 HTOL ········································································· 254 LTOL ·········································································· 255 HTSL ·········································································· 256 LTSL··········································································· 257 Endurance ····················································· 257 Data Retention··············································· 258 04. 환경 신뢰성 시험·············································· 259 Preconditioning·············································· 259 TC ································································· 263 TS ································································· 268 THS······························································· 268 PCTP······························································269 UHAST ·························································· 270 HAST····························································· 271 HALT····························································· 272 05. 기계적 신뢰성 시험·········································· 273 충격································································274 진동······························································· 275 구부림 ··························································· 275 비틀림·····························································276 08 반도체 용어해설 용어해설·································································· 282 |
저자 소개 1
한국과학기술원 재료공학과에서 학사, 석사 학위를 취득했고, 반도체 패키지를 위한 전해 도금 공정 및 재료 연구로 박사 학위를 취득했다. 이후 SK 하이닉스 반도체에서 SRAM & Flash 공정 개발에 참여했다가 2003년부터 반도체 패키지 개발 부서에서 RDL, Flip chip, Fan in WLCSP, TSV(HBM, 3DS, Wide I/O) 등의 Wafer Level Package 개발을 주도했는데, 특히 2013년에 SK하이닉스에서 세계 최초로 HBM을 개발할 때 패키지 개발 팀장으로서 기여했다. 2011년에는 미국 뉴욕주에 있는 연구 컨소시엄 SEMATECH에 파견
한국과학기술원 재료공학과에서 학사, 석사 학위를 취득했고, 반도체 패키지를 위한 전해 도금 공정 및 재료 연구로 박사 학위를 취득했다. 이후 SK 하이닉스 반도체에서 SRAM & Flash 공정 개발에 참여했다가 2003년부터 반도체 패키지 개발 부서에서 RDL, Flip chip, Fan in WLCSP, TSV(HBM, 3DS, Wide I/O) 등의 Wafer Level Package 개발을 주도했는데, 특히 2013년에 SK하이닉스에서 세계 최초로 HBM을 개발할 때 패키지 개발 팀장으로서 기여했다. 2011년에는 미국 뉴욕주에 있는 연구 컨소시엄 SEMATECH에 파견 나가서 TSV 패키지를 연구하기도 했으며, Semi Korea 기술 심포지엄 패키지 분과에서 2003년부터 기술 위원으로 활동한 경력을 인정받아 2015년에는 Semi로부터 공로상을 받았다.
2022년부터 한국 마이크로전자 및 패키징 학회(KMEPS)에서 기술분과위 위원장을 맡고 있고, 같은 해에 학회에서 기술상을 수상했다. 또한 Wafer Level Package 분야에서 다수의 국내외 논문 및 학회 발표, 특허 출원 등을 했는데, 이러한 기술 활동 외에도 후배 양성 및 패키지 기술 저변 확대를 위한 교육 활동에도 적극적으로 참여해 SK하이닉스 사내 강사는 물론 여러 대학, 업체, 연구소 등에서 반도체 패키지 관련 강의를 진행했다. 그 활동의 일환으로 2020년에는 ‘반도체 부가가치를 올리는 패키지와 테스트’라는 책을 SK하이닉스 후원으로 발간했다. 그리고 2024년에는 ‘AI시대에 대응하는 반도체 패키지와 테스트’라는 책을 추가로 발간했다.
SK하이닉스는 2023년 말에 퇴사했고, 2024년부터 Camtek이라는 Metrology & Inspection 장비를 만드는 회사의 한국 연구소를 맡고 있으며, 반도체, 특히 첨단 반도체 패키지 기술에 필요한 새로운 Metrology & Inspection 기술을 연구 개발하면서 반도체 패키지 산업의 기반 확립에 기여할 수 있는 강의 및 저서 활동도 틈나는 대로 하고 있다.
2022년부터 한국 마이크로전자 및 패키징 학회(KMEPS)에서 기술분과위 위원장을 맡고 있고, 같은 해에 학회에서 기술상을 수상했다. 또한 Wafer Level Package 분야에서 다수의 국내외 논문 및 학회 발표, 특허 출원 등을 했는데, 이러한 기술 활동 외에도 후배 양성 및 패키지 기술 저변 확대를 위한 교육 활동에도 적극적으로 참여해 SK하이닉스 사내 강사는 물론 여러 대학, 업체, 연구소 등에서 반도체 패키지 관련 강의를 진행했다. 그 활동의 일환으로 2020년에는 ‘반도체 부가가치를 올리는 패키지와 테스트’라는 책을 SK하이닉스 후원으로 발간했다. 그리고 2024년에는 ‘AI시대에 대응하는 반도체 패키지와 테스트’라는 책을 추가로 발간했다.
SK하이닉스는 2023년 말에 퇴사했고, 2024년부터 Camtek이라는 Metrology & Inspection 장비를 만드는 회사의 한국 연구소를 맡고 있으며, 반도체, 특히 첨단 반도체 패키지 기술에 필요한 새로운 Metrology & Inspection 기술을 연구 개발하면서 반도체 패키지 산업의 기반 확립에 기여할 수 있는 강의 및 저서 활동도 틈나는 대로 하고 있다.
서민석의 다른 상품
품목정보
- 발행일
- 2020년 03월 10일
- 쪽수, 무게, 크기
- 332쪽 | 914g | 178*245*30mm
- ISBN13
- 9791156858577
